The successful candidate for this position will join a technology leader, making rapid progress and be an integral member of a highly skilled and motivated team.
This role would help lead the design, development and verification of the next generation chip, modules & products.
To manage multiple team of engineers responsible for the silicon bring up.
This would involve managing directly or indirectly teams involved in Analog/ RF Design(PMU, Serdes, circuit design, PLLs), RTL design, verification, physical design, IP selection and integration as well as the validation and characterization of new silicon and rollout to production.
Desired Skills and Experience
Requirements: Bachelors degree in Electronics/Electrical Engineering or Computers, Masters or PhD preferred.
The ideal candidate has at least 15 years of experience in the development of semiconductor products.
Prior experience managing the development of complex SoC products is required.
The ideal candidate would have seen multiple ASIC or SoC programs through all stages of development, starting with architecture definition, development and finally ending in silicon bringup, validation and rollout to production.
The candidate must have deep technical background in architecture and logic design.
The candidate must also be able to lead and drive interactions with the 3rd party IP ecosystem.
The candidate must be self-driven, curious and eager to expand his or her horizons.
We are looking for a motivated individual who will guide his/her team but does not hesitate to roll up his or her sleeves if needed to get some work done. Experience with latest DSM SoC/ASIC methodologies is desirable. We are looking for a leader with strong people and interpersonal skills, a team player. The ideal candidate should have worked with global teams across time zones.
Salary: Not Disclosed by Recruiter
Industry:Semiconductors / Electronics
Functional Area:IT Software - Embedded, EDA, VLSI, ASIC, Chip Design
Role Category:Programming & Design
Employment Type:Permanent Job, Full Time
Desired Candidate Profile
UG:B.Tech/B.E. - Electrical, Electronics/Telecommunication, Energy
PG:M.Tech - Computers, Electrical, Electronics/Telecommunication
Doctorate:Ph.D - Communication, Computers, Electrical, Electronics/Telecommunication
The Company was founded in 2001 and was the first in the industry to launch an ultra-low power single-stream 802.11n chipset in late 2007. Again, in 2009 we pioneered the adoption of self-contained 802.11abgn modules into the then emerging M2M market. In 2013, we introduced the world's first multiprotocol wireless chipset for the Internet of Things (IoT) market - featuring dual-band Wi-Fi, dual-mode BT 4.1, 802.11p, and 802.15.4/ZigBee. We have created multiple products based on this chipset including n-Link (hosted), Connect-io-n (embedded), WiSeConnect (advanced embedded), WiSeMCU (embedded module with integrated MCU) and WaveCombo (V2X connectivity) modules. We offer technology and products covering multiple market segments in the Connected World/IoT (industrial, medical, automotive, wearables, connected home, smart energy, building automation and real-time locationing), mobile and networking markets.
Contact Company:Connectpro Management Consultants Pvt Ltd.