Lead a team to design, implement, and verify analog / mixed-signal systems for various motion sensor products.
Interface with digital design team to define and optimize sensor architectures and digital signal processing circuits.
Lead projects through the full product cycle, from spec definition, all the way to design, layout, tapeout, lab verification and productization
Contribute as a senior individual technical leader, and provide technical guidance to design teams.
Mentor junior engineers in all areas of product design (Analog and RF exposure in Serdes is welcome)
What You Need for this Position
Minimum MSEE +12 Years or PhD +10 Years of industry experience in RF or mixed-signal CMOS circuit design
Thorough understanding of RF and/or mixed signal systems and architecture trade-offs. Demonstrated ability to perform system analysis (using tools such as Matlab and Simulink), as well as analog and mixed signal circuit design (using tools such as Cadence)
Proven track record of designing low-power, low-noise, precision CMOS analog circuits for high volume manufacturing
Strong skills in designing & analyzing tradeoffs on various analog/mixed-signal systems such as receivers, transmitters/drivers, PLL's/VCO's, amplifiers, bandgap references, charge pumps, ADC's, and DAC's
Experience as IC lead with demonstrated success through the product life cycle
Diligent, detail-oriented, and willing to take the initiatives for process and flow improvements
Experience with managing design teams
Salary: Not Disclosed by Recruiter
Industry:Semiconductors / Electronics
Functional Area:IT Software - Embedded, EDA, VLSI, ASIC, Chip Design
Role Category:Project Management
Employment Type:Permanent Job, Full Time
Desired Candidate Profile
UG:B.Tech/B.E. - Computers, Electrical, Electronics/Telecommunication
PG:M.Tech - Computers, Electrical, Electronics/Telecommunication
Doctorate:Ph.D - Communication, Computers, Electrical, Electronics/Telecommunication
The Company was founded in 2001 and was the first in the industry to launch an ultra-low power single-stream 802.11n chipset in late 2007. Again, in 2009 we pioneered the adoption of self-contained 802.11abgn modules into the then emerging M2M market. In 2013, we introduced the world's first multiprotocol wireless chipset for the Internet of Things (IoT) market - featuring dual-band Wi-Fi, dual-mode BT 4.1, 802.11p, and 802.15.4/ZigBee. We have created multiple products based on this chipset including n-Link (hosted), Connect-io-n (embedded), WiSeConnect (advanced embedded), WiSeMCU (embedded module with integrated MCU) and WaveCombo (V2X connectivity) modules. We offer technology and products covering multiple market segments in the Connected World/IoT (industrial, medical, automotive, wearables, connected home, smart energy, building automation and real-time locationing), mobile and networking markets.
Contact Company:Connectpro Management Consultants Pvt Ltd.